Connect with us

Mobile

Realme X9 Pro – New flagship smartphone comes equipped with Dimensity 1200 chipset

Realme will be one of the first brands that will launch in 2021 flagship smartphone Realme X9 Pro at just announced a 6-nm chipset MediaTek Dimensity 1200 . With new capabilities, massive computing power and advanced AI and multimedia technologies, as well as low power consumption, the new processor is the ideal choice for 5G devices, ensuring seamless operation in all use cases.

Realme CEO and President Sky Lee commented on this information: “We have worked closely with MediaTek since the early days of our brand. Our company is one of the popularizers of 5G technology, we produce smartphones with advanced design, performance, and we have an excellent sales and reputation. That is why in 2021 realme will be one of the first to release a smartphone based on the latest Dimensity chipset for 5G and together with MediaTek will continue to work on the implementation of the 5G standard worldwide . 

Realme has previously released many models based on Dimensity chipsets , so the company has extensive experience in adapting and optimizing them for its products. So, the realme X7 Pro model used a productive Dimensity 1000+ , and realme 7 5G – Dimensity 800U . realme plans to continue partnering with a variety of chipset manufacturers and launch new flagship devices across multiple platforms.

More info – GSM Arena .

All TechWeek writers are indepentent and from many different countries. Some english misspelling and grammar mistakes may occur. Report article.

Advertisement
Latest news and reviews in hi-fi, home cinema and technology reviews, products, news, advice, videos and more, from around the world! All pictures and articles written on techweekmag.com are owned by respective freelance authors. If you find a article that violates copywrite infringement, please report article here!