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Qualcomm unveils new Wi-Fi chip and RB3 Gen 2 robotics platform with AI

Qualcomm is betting on the energy efficiency of the Wi-Fi chip, claiming an 88% reduction in power consumption

QUALCOMM UNVEILS NEW WI FI CHIP AND RB3 GEN 2 ROBOTICS PLATFORM WITH AI
QUALCOMM UNVEILS NEW WI-FI CHIP AND RB3 GEN 2 ROBOTICS PLATFORM WITH AI

Qualcomm has announced its latest Wi-Fi chip, the QCC730, which offers improved range, faster data speeds and lower power consumption. The new chip is dual-band, designed for IoT (Internet of Things) devices and offers direct connectivity to the cloud. Qualcomm is focusing on energy efficiency, claiming an 88% reduction in power consumption compared to the previous generation of Wi-Fi chips.

Wi-Fi QCC730 provides direct connectivity to the cloud and integration with the common smart home standard Matter. In addition, the chip also includes an open source SDK and IDE, offloading cloud connectivity through the software stack. It is positioned as an alternative to Bluetooth for IoT applications and can operate in both server and client modes.

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In addition to the QCC730 Wi-Fi chip, Qualcomm also announced its RB3 Gen 2 AI robotics platform. This is a mid-range single-chip system designed for enterprise and industrial solutions. It includes Qualcomm QCS6490 processor (octa-core, maximum frequency 2.7 GHz), Adreno 643 GPU, built-in Wi-Fi 6E chip, Bluetooth 5.2 and LE audio. There is also support for multiple sensors and cameras.

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Qualcomm is bringing the RB3 Gen 2 platform to a wider range of products, including drones, cameras and other industrial devices. Development kits include a power supply, speakers, USB cable, and board. The company offers Vision Kits with mounting brackets and a CSI camera interface. Qualcomm RB3 Gen 2 is expected to go on sale in June this year.

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